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base repository: im-tomu/tomu-hardware
base: a987253098ee
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head repository: im-tomu/tomu-hardware
compare: acfe708c7820
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  • 8 commits
  • 25 files changed
  • 1 contributor

Commits on Feb 14, 2018

  1. case: add temporary v0.4.4 case 

    Signed-off-by: Sean Cross <sean@xobs.io>
    @xobs
    xobs committed Feb 14, 2018
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  2. pcb: add v0.4.4 with improved 5V rail 

    The 5V trace is now bigger.

Signed-off-by: Sean Cross <sean@xobs.io>
    @xobs
    xobs committed Feb 14, 2018
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  3. case: increase pocket size to 0.8mm 

    This seems required.

Signed-off-by: Sean Cross <sean@xobs.io>
    @xobs
    xobs committed Feb 14, 2018
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Commits on Feb 21, 2018

  1. wip case edit 

    Signed-off-by: Sean Cross <sean@xobs.io>
    @xobs
    xobs committed Feb 21, 2018
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  2. pcb: add fill for GND for decoupling cap 

    Add a ground pour for the decoupling cap in the corner.

Signed-off-by: Sean Cross <sean@xobs.io>
    @xobs
    xobs committed Feb 21, 2018
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  3. pcb: increase copper going to 3.3V pad 

    Reroute one captouch trace and use two vias to tap into the 3.3V rail on
the backside.  This gives us more reliable 3.3V on pin 2.  Additionally,
we now have two vias going to the backside 3.3V rail, which should
improve the power flow to the other half of the board.

Signed-off-by: Sean Cross <sean@xobs.io>
    @xobs
    xobs committed Feb 21, 2018
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  4. tomu: tag v0.4.6 

    This cleans up some traces and improves QFN layout by reducing the
soldermask opening.

Signed-off-by: Sean Cross <sean@xobs.io>
    @xobs
    xobs committed Feb 21, 2018
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  5. v0.4.6: release project 

    Build and release v0.4.6.

Signed-off-by: Sean Cross <sean@xobs.io>
    @xobs
    xobs committed Feb 21, 2018
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