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base repository: azonenberg/starshipraider
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  • 1 commit
  • 1 file changed
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Commits on Jun 24, 2020

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Showing with 16 additions and 2 deletions.
  1. +16 −2 boards/MAXWELL/maxwell-main/schematic-checklist.md
18 changes: 16 additions & 2 deletions boards/MAXWELL/maxwell-main/schematic-checklist.md
Original file line number Diff line number Diff line change
@@ -51,8 +51,22 @@ off as invalid.
* [x] Config
* [x] Bank 14
* [x] Bank 34
* [ ] Schematic symbol matches chosen component package
* [ ] Thermal pads are connected to correct power rail (may not always be ground)
* [x] Schematic symbol matches chosen component package
* [x] Thermal pads are connected to correct power rail (may not always be ground)
* NCP45525: pad is Vin
* S25FL128: pad is not mentioned in datasheet at all, assuming it's NC
* SY56017R: pad is ground
* KSZ9031: pad is ground
* AT24MAC402: pad is not mentioned in datasheet at all, assuming it's NC
* SY89835: pad is ground
* LMH7322: pad is Vee
* ADCMP582: pad is NC
* MCP1755: pad is ground
* RT9088: pad is not internally connected but should be soldered to ground for heatsinking
* MIC2605: pad is "for thermal cooling", no electrical functionality mentioned.\
Connecting to ground plane for heatsinking.
* LM27761: pad is ground
* AT30TS74: pad is not mentioned in datasheet at all, assuming it's NC
* [x] Debug interfaces are not power gated in sleep mode
* FPGAs are completely shut down when in soft powerdown
* STM32 JTAG runs in 3V3_SB power domain