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base repository: GlasgowEmbedded/glasgow
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head repository: GlasgowEmbedded/glasgow
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compare: 72b3aff67c0b
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  • 12 commits
  • 13 files changed
  • 2 contributors

Commits on Sep 23, 2020

  1. revC2: Fix ESD protection footprint & clean up routing

    @jordiorlando
    jordiorlando committed Sep 23, 2020
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    17fcc56 View commit details

  2. revC2: Clean up VSENSE routing

    @jordiorlando
    jordiorlando committed Sep 23, 2020
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    799c98b View commit details

  3. revC2: Modify reset switch footprint 

    - Fix incorrect F.Fab drawing
- Change mounting-pad dimensions/design
    @jordiorlando
    jordiorlando committed Sep 23, 2020
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    8219321 View commit details

  4. revC2: Clean up silkscreen & ADC routing

    @jordiorlando
    jordiorlando committed Sep 23, 2020
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    bf4b589 View commit details

  5. revC2: More work on silkscreen

    @jordiorlando
    jordiorlando committed Sep 23, 2020
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    1bff71e View commit details

  6. revC2: Add DNP footprints

    @jordiorlando
    jordiorlando committed Sep 23, 2020
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    61652dd View commit details

  7. revC2: Fix 3D model for Molex KK

    @jordiorlando
    jordiorlando committed Sep 23, 2020
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    0b3a88a View commit details

  8. revC2: Fix LVDS alignment hole layers

    @jordiorlando
    jordiorlando committed Sep 23, 2020
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    7c81a68 View commit details

  9. revC2: Lots of cleanup to VIO set/sense routing

    @jordiorlando
    jordiorlando committed Sep 23, 2020
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    e9567ec View commit details

Commits on Sep 24, 2020

  1. revC2: Fix review notes

    @jordiorlando
    jordiorlando committed Sep 24, 2020
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    ad94eca View commit details

  2. revC2: fix paste-in-hole and wave solder keepout

    @jordiorlando
    jordiorlando committed Sep 24, 2020
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    17c767f View commit details

Commits on Sep 26, 2020

  1. revC2: Connected a few remaining ground pad via solid to ground plane.

    @esden
    esden committed Sep 26, 2020
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    72b3aff View commit details